The mechanisms of thermalcuring and photocuring are studied, and besides, the effects on curing kinetics are also analyzed. 对乙烯基酯树脂的两种固化方式的固化机理和固化影响因素进行了分析。
The preperation method and adhesion technology was introduced,the curing mechanism and resisting high temperature property was explored. 介绍了制备方法和粘接工艺，探讨了常温固化机理及耐高温性能。
