electronic packaging

英 美
  • 电子封装,电子组装,电子电路组装
    1. This edition also includes coverage of new topics such as nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering.
      这个版本还包括涵盖新课题,如纳米技术,微机电系统,电子封装,全球气候变化,电动和混合动力汽车,生物工程。