Some key problems in developing lead-free solder were analyzed and some suggestions of solving the problems were put forward. 分析了无铅钎料研究必须解决的几个关键问题，并提出了解决这些问题的思路和建议。
And techniques to make lead-free solder bumping with electroplating are illustrated. 重点阐述了采用电镀制作无铅焊料凸点的方法。
The test results show that the modifying solder has good solderability,whereas,the excellent flux is rosin-ethanol or rosin-isopropanol solution. 在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
