And techniques to make lead-free solder bumping with electroplating are illustrated. 重点阐述了采用电镀制作无铅焊料凸点的方法。
The test results show that the modifying solder has good solderability,whereas,the excellent flux is rosin-ethanol or rosin-isopropanol solution. 在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。
